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Arco 2P T62M 32D (14 x 15 x 1.915 mm) Package

Technical Risk Assessment (TRA) Summary

Package Information

Item	Specification
Package Size	14 x 15 x 1.915 mm
Controller Die	3.4 x 4.3 x 0.10 mm
DRAM Die	6.8 x 10.9 x 0.045 mm
Die Attach Film	20 μm (Bottom 4 dies), 10 μm (Upper 28 dies)
Substrate Thickness	370 μm (100 μm Core + 20 μm Prepreg)
Mold Body Thickness	1151 μm
Chip-to-Mold Clearance	101 μm

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Key Technical Risks

1. Die Mark Exposure Risk

Risk Description

• Due to the relatively thick die stack and limited mold cap thickness, the top die surface may become exposed after molding.
• DRAM thickness variation may further reduce mold coverage margin.

Potential Impact

• Die mark exposure.
• Cosmetic defect and reliability concern.

Recommended Action

• Tighten incoming DRAM thickness tolerance control.
• Verify mold cap coverage through stack-up simulation and DOE evaluation.

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2. Underfill Dispensing Process Risk

Risk Description

• Available dispensing space between package edge and controller die edge is only 610 μm.
• Limited dispensing window may affect underfill flow and process stability.

Potential Impact

• Underfill voids.
• Incomplete filling.
• Yield loss.

Recommended Action

• Conduct underfill dispensing DOE.
• Optimize dispense pattern and process parameters.

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3. Strip Warpage Risk

Risk Description

• Thick substrate construction (370 μm) may generate substrate-side bending after underfill curing.
• Excessive strip warpage may affect die bond alignment accuracy.

Potential Impact

• CCD focusing difficulty.
• Die recognition failure.
• Die placement error and X-out.

Recommended Action

• Evaluate strip warpage after underfill curing.
• Perform assembly DOE to verify die bond process window.

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4. Substrate Material CTE Mismatch Risk

Risk Description

• High CTE substrate materials may increase thermal stress between substrate and silicon die.

Potential Impact

• Underfill non-wetting.
• Delamination.
• Reliability degradation.

Recommended Action

• Select low-CTE core and prepreg materials.
• Target substrate CTE as close as possible to silicon die CTE (3–5 ppm/°C).

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5. Wire Bond Clearance Risk

Risk Description

• Bond pad locations for Dies 2, 3, 6, 7, 31, and 32 are located too close to adjacent die edges.

Potential Impact

• Wire sweep.
• Wire-to-die interference.
• Bonding instability.

Recommended Action

• Recommend customer relocate bond pads further away from die edges.
• Verify wire loop profile through bonding simulation.

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6. Thin DRAM Cascade Bonding Risk

Risk Description

• Existing production experience is limited to 45 μm DRAM forward bonding with approximately 630 μm die overhang.
• No prior cascade bonding experience for 45 μm DRAM with 400 μm die overhang configuration.

Potential Impact

• Die crack.
• Die shift.
• Assembly yield risk.

Recommended Action

• Execute DOE evaluation to verify cascade bonding feasibility and process margin.

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7. Die Crack Risk Due to Limited Die Spacing

Risk Description

• Die-to-die spacing is limited, increasing mechanical stress during bonding.

Potential Impact

• Die edge crack.
• Silicon damage.

Recommended Action

• Implement cascade bumpless bonding for D3–D4.
• Reduce bonding tool impact frequency on lower dies.
• Verify die integrity through DOE validation.

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Overall Assessment

The package structure is technically feasible; however, the design presents elevated risks in the following areas:

1. Mold coverage margin.
2. Underfill processability.
3. Strip warpage after underfill curing.
4. Substrate CTE mismatch.
5. Wire bond clearance.
6. Thin die cascade bonding capability.
7. Die crack susceptibility due to limited die spacing.

Process DOE and material optimization are strongly recommended prior to production qualification.

Arco 2P T62M 32D 14x15x1.915mm package size TRA

 Arco 2P T62M 32D 14x15x1.915mm package size TRA summary request

Controller size: 3.4x4.3x0.1 mm

DRAM size: 6.8x10.9X0.045

Die attached film: 20um on 4 layers die & 10um on upper 28 dies

Substrate thickness: 370 um with 100um core & 20um Pregpreg

Mold body thickness: 1151um, chip to mold clearance :101um

Risk concern:

1. Die mark exposure if thicker die & thinner mold body, need special control DRAM thickness tolerance

2. Dispensing underfill space is limited, only remained 610um from package edge to controller edge, need special control

3. As the thicker substrate thickness, after underfill curing, the strip warpage may bend towards substrate side and caused die bond workability issue when the CCD cannot focus clearly on die and X-out

 4. need to select low CTE core & PP on substrate to close to die CTE(3~5ppm/oC) to avoid non-wetting risk 

5.The distance between higher die to bond point on substate are too close, especially die 2/3/6/7/31/32), suggest customer to place further away from die edge

6. As the DRAM 45um thickness only has forward bond experience on 630um overhang die, but we did not have cascase bond on 400um die , need DOE to confirm workability

7. As the distance between dies are too close, will try to use cascade bumpless bond on D3~D4 to reduce the hitting times on D3 to avoid die crack concern

How do i write this summary risk into report, or could you show the schematic for better understanding

Via last vs Via Middle

Common characteristic:
1.DRAM+interposer are already bonded (hybrid bond) before TSV
2.TSVs Cu embedded before incoming

Via last flow
i)BSG:BG-->Backside CVD-->PR litho
ii)TSV formation: TSV etch-->Linear deposition-->Etch-->TSV TiCu deposition
iii)RDL-->PI-->UBM-->C4 bump-->Dicing

1.TSV is etched after wafer thinning(435+12.5+50)
2. TSV depth is shorter(interposer 50um)

Via middle flow:
i)Early thinning & oxide: Wafer trim-->BG-->CVD oxide-->BG/Si CMP
ii)TSV reveal+TSV dielectric:TSV reveal etch-->TSV CVD-->Oxide CMP
iii) Bump : PVD TiCu-->PI PSV-->ECD Cu/SnAg-->reflow
iv)Final front side Grind-->Dicing

*TSV &bump is processed on thicker wafer (775+12.5+108um)

A Day of Fighting a Cold

 Over the past few days, I have not been feeling well. I developed a runny nose, my heart was beating faster than usual, and my body felt unusually warm at night while I was sleeping. These symptoms were also reflected in the data recorded by my Apple Watch, which made me even more concerned. I worried that my condition might worsen and turn into a cough in the coming days.

Because of this concern, I woke up earlier than usual today and went to the market to buy lemons and kumquats, hoping to strengthen my body with more vitamin C. After searching online, I learned that drinking coffee could cause dehydration, so I decided to give up my morning coffee and put it away in the refrigerator.

In the evening, after a meeting with my process team, I shared my condition with a colleague. He kindly gave me a packet of Japanese cold medicine to help relieve my symptoms. To my surprise, the medicine worked much faster and more effectively than the lemons and kumquats. Within thirty minutes of taking it, my runny nose completely stopped.

I felt deeply relieved and grateful. Thanks to my colleague’s kindness and the effectiveness of the medicine, my condition improved quickly. I thanked God for this small but meaningful recovery and hoped that my health would continue to improve in the coming days.

My Feelings About the Fall of President Maduro

When I heard the news about President Maduro being captured, my first reaction was a deep sense of relief. For many people, this may simply be another political headline, but for me, it is closely connected to the lives and suffering of my friends from Venezuela. Over the years, I have listened to their stories of economic collapse, fear, and hopelessness. Because of them, Venezuela is not just a country on the news—it is a place filled with real people I care about.

Under Maduro’s leadership, Venezuela’s economy deteriorated dramatically. Even well-educated professionals such as pharmacists and teachers struggled to survive. The value of the currency dropped so severely that ordinary citizens could no longer afford basic necessities. My friends told me about shortages, insecurity, and the constant stress of not knowing what tomorrow would bring. Hearing these experiences made me feel angry and helpless, as no government should allow its people to live in such conditions.

One of my close friends was a pharmacist in Venezuela, a profession that should have provided dignity and stability. However, she was forced to leave her country in order to have a chance at a normal life. Even though she now works in a position far below her qualifications, she lives with more safety and peace than she ever did back home. This reality deeply shaped my view of the Maduro government.

Because of this, I feel hopeful that Venezuela may finally have an opportunity for change. I sincerely wish that my friends who remain there can live safely, freely, and happily in the future. If international involvement—especially from the United States—can help restore stability, order, and economic recovery, then I hope it will lead Venezuela toward a better path. Above all, my wish is simple: that Venezuelan citizens can live without fear, with dignity, and with hope for tomorrow.

Bad habit and change

 A few years ago, I developed a bad habit without realizing it at first. I became somewhat addicted to alcohol. I used to tell myself that drinking was only for the weekend, a way to relax and help me fall asleep after a long week. At the beginning, it felt harmless and even comforting.

Over time, however, I noticed that I was depending on alcohol more than I should. Relaxation started to feel impossible without it. That was the moment I understood that this habit was no longer a choice—it was becoming a reliance.

I decided to make a change in a very simple but firm way. I stopped buying alcohol and made sure there was none in my refrigerator. By removing the temptation from my daily environment, I gave myself fewer chances to give in. At first, it was uncomfortable, and weekends felt strange without my usual routine. But gradually, my body and mind adapted.

Looking back, I am proud of this decision. Breaking a bad habit does not always require dramatic actions; sometimes it starts with a small, clear rule and self-discipline. This experience taught me that real relaxation comes from a healthy mind, not from escaping reality. It also reminded me that I am capable of changing when I truly decide to do so.

My precious baby Lingling

    I have a 13-year-old female Shiba Inu from Japan. She is old now, but she is still my precious baby. She has been spoiled her whole life, and I am happy to let her be. Every day, I carry her up and down the stairs just so she can go outside for a short walk. My arms or legs get tired, but my heart never complains.

    At mealtime, she eats with caution, constantly watching Amu, afraid he might steal her food. She eats quickly, nervously. And if the food is not enough, she barks at me again, trusting that I will understand her needs. She trusts me completely.

    Every night, after eating her dinner, she will bark at me again around midnight, asking for more food. Even when I pretend to be asleep, she knows. Her small barks are demanding, but they are also a reminder that she is still here, still hungry, still full of life.

    She needs a dog bed everywhere—one in the bedroom, one in the living room, and even one in my landlord’s room. Every place must have her own bed, as if she wants to leave her presence behind wherever she rests. When Amu, the Husky my landlord raises, takes her bed, she never blames him. Instead, she looks at me with angry eyes, as if saying, “Why didn’t you protect what belongs to me?” She is smart like that. She always knows who to blame.

    Last month, she became sick and was diagnosed with gastroenteritis after blood tests and an X-ray. The veterinarian told me she has many bone spurs around her spine. Hearing that broke my heart. Thankfully, I have been giving her Antinol regularly to ease her pain. The doctor praised me for taking good care of her and said that because of this, she can still walk properly. If she had not received this care, she might have become paralyzed suddenly.

I realized then how fragile her time is, and how precious every ordinary day has become. Carrying her, feeding her, listening to her bark—it is all love. As long as she needs me, I will be there.

Is it worth being married?

Today marks a new beginning, the first day of 2026. I find myself thinking seriously about marriage and whether raising a child is realistic in this generation, especially with my current income of about NTD 60,000 per month after tax.

When I look at my finances honestly, I know my resources are not abundant. Raising a child means endless expenses—food, childcare, school fees, and extra tutoring. Just imagining these costs already feels heavy. It’s hard to feel confident about the future when everything seems to require more money than I can comfortably afford.

I also think about marriage. If I were to marry, there seems to be an unspoken rule that the man should earn more than I do—maybe at least NTD 100,000 a month—to live a stable and comfortable life. But a higher income often comes with higher expectations. His family might expect regular visits during Lunar New Year and every major festival. There would be family gatherings, preparations, cooking, and gifts. If someone in his family became ill, I might be expected to take care of them, too. These responsibilities feel overwhelming when I imagine them becoming part of my everyday life.

Then there is the question that troubles me the most: the future. If I raise a child and they grow up, will they take care of me when I am old? In my mother’s generation, children naturally carried the responsibility of caring for their parents. But in this generation, shaped so strongly by the internet and individual freedom, nothing feels guaranteed anymore. People are no longer expected to sacrifice their lives for their parents, and I don’t know if it is fair—or realistic—to expect that kind of devotion.

Thinking about all of this, I feel that marriage and having children are no longer simple life milestones. They are complicated decisions filled with uncertainty, responsibility, and quiet fear. At the beginning of 2026, I don’t have clear answers—only questions that stay with me longer than I expected.

Reflow soldering process

 Solder paste is used to temporary attach to the anywhere to all the contact pads, after which the assembly is subjected to the controlled heat. Solder paste reflows in a molten state, creating permanent solder joints. Heating can be accomplished by passing the assembly, through a reflow oven.

Usually four stages: preheat,thermal soak, reflow, heating

Preheat zone: climb towards to a target soak, dwell temperature.

Why lead free?

1. Health care

2. Environment: To align with RoHS with the European Union

Tin frequently serves as a principle solder due to its low melting point and excellent wetting properties. Cu & Ag are sometimes added to enhance mechanical strength, and electrical properties of the solder. 

-->Lead based solder: Tin-60%, Pb-40%, melting point:188oC

 -->Lead free Solder: Sn-Ag-Cu, >95% Tin, melting point: 227oC, but less ductile than lead based solder, rendering it has susceptible to mechanical stress, tends to be oxidize more rapidly which can adversely affect its wetting properties and solder joint quality.

What is soldering

A process involves solder, to join together metal surfaces. The solder is heated until it melts and flows into the joint between the two surfaces. Upon cooling, it hardens and forms a reliable electrical and mechanical connection.

Before soldering, the surface of metal should be cleaned thoroughly to remove any oxidations or contaminations that could interfere the formation of a good solder joint.

Vaccum effectively reduce solder void in soldering process

Siemens-EDA Summary

A.Calibre 3D thermal

1.placement & stacking analysis

2.thermal verification :power map 

Simcenter Flotherm : golden tool for 3D thermal simulation & exporting 3D thermal results

Ease of use, designer friendly use, speed, high accuracy providing color maps in 1 day. From simplified power map to final design with detailed power & GDS inputs.

Accuracy: the worst-case difference between simulation and the measured data :3.75%

Customer experince: UMC, TSMC, Intel

B. 3Dblox

Unified format and standardized language

from introduce chiplet detail information, top down to confirm connectivity

C. DFT

scalable from 2D to 3D

die integration & dies at package level

test between dies after AP & diagnosis(in

Complaint with IEEE1149.1, IEEE1500, IEEE1838

Tessant: serial access port composed PTAP/STAP

die wrapper register (DWR) for dies isolation

HBM usually come with IEEE1500 interface, helps to validate the speed of SOC, HBM

bump map, probe map, spacing, die to die , bump analysis, repair method

D: Innovator XPD

macro complex data 

physical reuse- HBM net, auto-replacement, function: rotate, mirror,

original separately process, 500,000 pin can be processed in short time period

tuning in real time, 75% cycle time reduction

 新光電気工業の登録です。    本製品に関する特許も取得しております

チップや能動。受動部品を内蔵した

独自の半導体パックージグ技術を駆使し、優れ電気特性と高い

信頼性を備えた小型　低背パックージとして、小型

iTHOP preshrinkage issue

 The actual shrinkage rate of iTHOP is higher than anticipated, influenced by the smile warpage behavior. The inspection of iTHOP from mark to mark distance was validated that its value is smaller than actual design value. 

Based on our observation, the larger warpage , longer distance between mark to mark, which exhibits more expansion which was validated by the stage DOE experiment from Shinko & PTI. The inner flip chip pad showed that it has higher shrinkage rate, making alignment with the bumping from HBM side challenging.

The thinner organic interposer is more likely to be influenced by the properties of interposer material, it tend to be expand more freely even though vacuumed by the stage, but once bonded, it will be more easily pulled and conformed by ABF substrate.

-->Understanding the interactions can help in optimizing the design to achieve the desired alignment.

3D X ray imaging analysis request

 Since the expansion of substrate during heating with TCB bonding method, different temperature bonding have been studied to reduce the misalignment issue. The effect of temperature is limited, based on 2D X-ray imaging results showed that the farther away from the center, the misalignment value is worsen. We need further analysis with 3D X-ray to analysis if any voids, solder crack after TCB bonding

What is Q3D simulation

Ansys Q3D Extractor is a 3D quasi-static electromagnetic simulation software tool and lumped RLC parameter extractor.  It calculates fields, inductances, resistances, and capacitances. This tools that specializes in low-frequency power applications. It can quickly determine parasitic values of inductance, capacitance, resistance from 3D structures.Q3D can generate frequency dependent equivalent circuit netlists in many formats.

It provides automatic, accurate, and efficietn solution after refining the mesh throughout structure.

HBM offset iTHOP alignment issue

 The offset between HBM and iTHOP is causing the alignment challenges.

Given the differences in expansion between silicon chip and organic interposer substrate, there is potential for cracks or delamination by the high stress generated by the newly formed interconnections. The solder integrity was verified with X-ray and peeling test. The optical observation of the samples after chip pulls on the iTHOP showed that flip chip pad were pulled out with the chip, implying the good adhesion, and hence good joints. Samples were then subjected to reliability stressing to downselect the optimal process for subsequent study.

In the case of TCB process, the substrate is heated and chip joint while it is held to the stage by vacuum.

The large chip size maybe arranged assemmetrically with respect to the center of the substrate. Pads on an organic substrate fluctuate in planar position due to the expansion and contraction of the substrate material as the substrate is heated and cooled. The amount of pad fluctuations varies greatly from place to place.

By applying appropriate compensation in the circuity design of the organic substrate, the micro bumps and pads are designed to align at the temperature at which the solder melts during chip bonding .If the compensation value is not set correctly, it is difficult to ensure good bonding. Even if the center of the chip is perfectly aligned, the further away from the center of the chip, the more serous alignment becomes. If the chip size is small, the degree of misalignment at the edge of the chip will be relatively small. 

The direction of distortion depended on the position of pads.

HBM introduction

The special memory which powering deep learning revolution & AI

MI300: AI acceralator which use HBM

HBM does not refer to a special type of dynamic RAM memory cell or special chip.Rather it is a standard administered by the Joint Electron Device Engineering Council or JEDEC - for interfacing the DRAM and the compute. HBM introduces the concept of stacking the DRAM dies and running many independent memory channels through the stack. The goal is to provide very high data rate transfers for more advanced computing applications like those for AI which are more amenable to parallelism. The vendor can also choose to add a logic base die - as is  shown in the JEDEC spec diagram. This additional logic is for redistributing signals, test logic, and other external commnuncations. JEDEC's standard defines for the manufacturer how the HBM system has to work and what features they need to support. It helps with the commands and signals sent through the memory channel in the DRAM stack, for instance. But it does not specify how the vendor might structure the stack nor does it specify things outside the stack. This allows various HBM vendors in the memory industry to offer a differentiated products. HBM buyers can put your HBM stack right on the top of your CPU or GPU die. Or do what AMD/NVDIA which is to add a silicon interposer to connect multiple HBM die stacks to your GPU-like a PCB. JEDEC also administers other standards like DDR, LPDDR. 

    DDR is the standard you might be most familiar with- used for general purpose memory modules like those you put into your PC. The traditional memory interface standard for graphics cards is GDDR or Graphics Double Data Rate. Right now they are on their sixth generation-GDDR6. There are few gaming cards using it. Why do we need another standard? There are a few things that make it less suitable for heavy AI processing. First, while each new GDDR standard does feature higher data rates, they also employ a point-to-point connection. This means that each memory channel connects to just one module of memory. This is in contrast to HBM, where channels run through all the modules in the stack. GDDR's single channel makes it harder to scale the system's total memory capacity because it means we have to scale that single module's memory capacity which essentially requires us to shrink down DRAM cells even more which is hard, I did a whole video about this while ago discussing the 3D DRAM cell. 

    Future shrinks seem to require new capacitor structures like the pillar which may or may not be actually manufacturable. By vertically stacking the modules, HBM makes it conceptually easy to raise the memory capacity. There are also some physical size gains as well when it 

Reply the concerning about the failure analysis method

    As we know that the samples from substrate side has been grounded down to be thinner, it has resulted in an uneven surface. Due to this uneveneess, when you removed the chip from the top side, the microbump pad may not all to be exposed at the same surface level. This non-uniformity could potentially affect the open short test results as they probably not to make the consistent contact with their corresponding counterparts.

    The thickness of the samples after removing chip also is very concerning. Cold mounting may not be suitable for extremely thin samples. This method cannot precisely targeted to the desired positions or it does not compromise the sample's structural integrital. The air bubbles or voids may form during embedding process, affecting subsequent analysis. It should be more risky than previous PFA proposed by PTI.

    I confirmed with PTI related person, PTI did not have available test kits with fine probe. Anyway,  I still asked these questions to Shinko Japan, we are still waiting their answers. I can predict the answer is not promising.

How to reply customer about the failure analysis time

     At this stage, we are awaiting for internal approvals, which may take some time.

    Once approved are secured, we will expedite the failure analysis procedure and provide you with an estimated completion time for the failure analysis.

UMI HBM P1 PJ preliminary design review

    Today I would like to present a preliminary design phase of the UMI P0 project. The body of the HBM package measures 65x55x4.5mm, the package type is HSFCBGA, it contains 1930 balls. The HBM cube is made of PTI P8 site and the flip chip assembly site is in P11B site. Here is the list of roles related to this project, product engineer is Chris and Sales is Ted.

The purpose of design review is to provide sufficient information, evaluate progress, technical adequacy, and risk resolution of the selected design approach, to determine the each design's compatibility with the requirements for the configuration items, to access the technical risk associated with the selected manufacturing methods and processes, to establish the existence and compatibility of the physical and functional interfaces among the configuration items and other items of equipments, facilities, software, and personnel.

    This is the milestone of UMI P1 project was kicked of by Nov of last year. All drawings have been approved by next month December, and the preliminary design review has been finished on January of this year. We estimate will start the setup & ES from end of May. The HBM cube is made of PTI P8 site and sent to customer for finat testing and return the know good dies to PTI for proceeding the corresponding flow. The cube is diced and secured in metal ring frames, and then transport to another site. And now all the related tooling kits has been arrived at PTI and ready for setup.

    This page demonstrates that the overall P0,P1,P2 project structure, application and status. All of them will be applied for AI or High performance computer. This three project has no big differences but only package size and different wafer node. PTI will start to build HBM cube since from P1 project. UMI managed all the consigned direct material in assembly for the P0 project and has shipped out the package to UMI by end of last year. Estimate to build QT samples from this end of year and HVM will be next year. UMI & PTI are cooperating design drawings rcently.

    The overall project information was published by UMI, which included the HBM, SOC, organic interposer and package substrate. HBM cube of P0 was provided by UMI but customized by UMI in P1 &P2 . All these projects shared the same TSMC SOC wafer with 1pcs wafer. They also shared the same organic interposer with the same 2um/2um line space, 6L and 40/40um line space with 10 layers build up substrate.

    The ES samples of P0 project has been shipped out to UMI before the end of last year. Here is the overall related flow, direct, indirect material & Tooling kits preparation schedule for your reference.

    As we knew that all the material consigned by customer for P0 project, when PTI received the HBM/SOC/ iTHOP, PTI utilized thermocompression bond on iTHOP, and filled the gap between chip and substrate with capillary underfill. The stiffiner ring are bonded on the substrate, and then flipped the package for SMT & ball mounting.

To stack and connect bumped dies in package, PTI uses thermal compression bonding. After peeling the HBM/SOC chip side & iTHOP side, the remained solder amount appeared that the solder joint strength is robust enough. The samples has been executed the cross sectional examination with SEM, the bump gap between chip & iTHOP is close to the design value. The X-ray test results analyzed the placement accuracy of TCB meet the specifications.

     The top director has announced that the 1st HBM cube could be finished by the end of May, the flip chip AP must be ready for setup & ES to meet the development schedule. The lower diagram showed that the basic flow of P1 project, the incoming wafer B will do the microbumps , Backside grinding, wafer mount and dicing, for the incoming A will the PI firstly and then do the microbumps and copper pillar bumps correspondingly. At the BEOL site, PTI mount the die B on the die A with CoW process, and then molding. For the mold grinding, the rough grinding Z1 will be processed in P8 but the fine grinding processed in P11. After grinding, copper pillar bump will be done on the Cu post.

To make a copper bumps, a surface is depostied with an under-bump-metallurgy, then, a photoresist is applied on the UBM, the desired bump size is patterned and etched, forming a small gap in the resist. A copper layer is plated on a surface, forming a pillar in the gap. The material is reflowed or heated, froming the bump.

Introduce myself as a new collaegue

Hope you are doing well! 

I hope this message finds you well.

My name is Christine, and I am excited to introduce myself as a new team member and will be collaborating with you on this project.

I am eager to contribute to our collective goals and learn from each of you.

and I am reaching out to you as the new colleague who will be taking over this project.

I understand that transitions like these can sometimes be challenging, but please know that my primary goal is to ensure a smooth handover process and to maintain the momentum of the project. I am committed to upholding the standards of excellence set by Kevin Wang and to continue building on the progress made so far.

To give you a bit of background about myself, I have relevant package design experience in PTI over 12 years, especially in relation to the Intel project. I am excited about the opportunity to collaborate with you and the rest of the team to drive this project forward successfully.

I would greatly appreciate the opportunity to connect with you at your earliest convenience to discuss any ongoing tasks, objectives, or concerns you may have regarding the project. Please let me know a time that works best for you, and I will make myself available.

Thank you for your cooperation and support during this transition period. I look forward to working closely with you and the team to achieve our shared goals.

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I hope this email finds you well. My name is [Your Name], and I'm excited to introduce myself as your new colleague who will be collaborating with you on the [Project Name] project.

I understand the importance of effective teamwork in achieving project success, and I am eager to bring my skills and expertise to the table to contribute to our collective efforts.

In my previous role at [Previous Company/Project], I [briefly mention relevant experience or skills]. I believe that my background in [mention relevant skills or expertise] aligns well with the objectives of the [Project Name] project, and I am committed to working collaboratively with you to achieve our goals.

I am looking forward to learning from your insights and expertise and to leveraging our combined strengths to drive the project forward. I believe that open communication and a spirit of collaboration are key to our success, and I am committed to fostering a positive and productive working relationship with you.

Please feel free to reach out to me at any time to discuss the project further or to share any thoughts or ideas you may have. I am here to support you in any way I can and am eager to get started on our collaboration.

Thank you for welcoming me to the team, and I am excited about the opportunity to work together on the [Project Name] project.