2024年6月24日 星期一

3D X ray imaging analysis request

 Since the expansion of substrate during heating with TCB bonding method, different temperature bonding have been studied to reduce the misalignment issue. The effect of temperature is limited, based on 2D X-ray imaging results showed that the farther away from the center, the misalignment value is worsen. We need further analysis with 3D X-ray to analysis if any voids, solder crack after TCB bonding

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