Since the expansion of substrate during heating with TCB bonding method, different temperature bonding have been studied to reduce the misalignment issue. The effect of temperature is limited, based on 2D X-ray imaging results showed that the farther away from the center, the misalignment value is worsen. We need further analysis with 3D X-ray to analysis if any voids, solder crack after TCB bonding
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Hi Florence, Venkata Thanks for sending out the modified design, we've sent out the strip design to our vendor, we should close the...
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Fourier transform infrared spectroscopy uses the Fourier transform process to translate the interferogram into the actual spectrum. FTI...
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