Arco 2P T62M 32D 14x15x1.915mm package size TRA

 Arco 2P T62M 32D 14x15x1.915mm package size TRA summary request

Controller size: 3.4x4.3x0.1 mm

DRAM size: 6.8x10.9X0.045

Die attached film: 20um on 4 layers die & 10um on upper 28 dies

Substrate thickness: 370 um with 100um core & 20um Pregpreg

Mold body thickness: 1151um, chip to mold clearance :101um

Risk concern:

1. Die mark exposure if thicker die & thinner mold body, need special control DRAM thickness tolerance

2. Dispensing underfill space is limited, only remained 610um from package edge to controller edge, need special control

3. As the thicker substrate thickness, after underfill curing, the strip warpage may bend towards substrate side and caused die bond workability issue when the CCD cannot focus clearly on die and X-out

 4. need to select low CTE core & PP on substrate to close to die CTE(3~5ppm/oC) to avoid non-wetting risk 

5.The distance between higher die to bond point on substate are too close, especially die 2/3/6/7/31/32), suggest customer to place further away from die edge

6. As the DRAM 45um thickness only has forward bond experience on 630um overhang die, but we did not have cascase bond on 400um die , need DOE to confirm workability

7. As the distance between dies are too close, will try to use cascade bumpless bond on D3~D4 to reduce the hitting times on D3 to avoid die crack concern

How do i write this summary risk into report, or could you show the schematic for better understanding