2024年5月6日 星期一

How to reply customer about the failure analysis time

     At this stage, we are awaiting for internal approvals, which may take some time.

    Once approved are secured, we will expedite the failure analysis procedure and provide you with an estimated completion time for the failure analysis.

沒有留言:

張貼留言

Via last vs Via Middle

Common characteristic: 1.DRAM+interposer are already bonded (hybrid bond) before TSV 2.TSVs Cu embedded  before incoming Via last flow i) BS...