Siemens-EDA Summary

A.Calibre 3D thermal

1.placement & stacking analysis

2.thermal verification :power map 

Simcenter Flotherm : golden tool for 3D thermal simulation & exporting 3D thermal results

Ease of use, designer friendly use, speed, high accuracy providing color maps in 1 day. From simplified power map to final design with detailed power & GDS inputs.

Accuracy: the worst-case difference between simulation and the measured data :3.75%

Customer experince: UMC, TSMC, Intel

B. 3Dblox

Unified format and standardized language

from introduce chiplet detail information, top down to confirm connectivity

C. DFT

scalable from 2D to 3D

die integration & dies at package level

test between dies after AP & diagnosis(in

Complaint with IEEE1149.1, IEEE1500, IEEE1838

Tessant: serial access port composed PTAP/STAP

die wrapper register (DWR) for dies isolation

HBM usually come with IEEE1500 interface, helps to validate the speed of SOC, HBM

bump map, probe map, spacing, die to die , bump analysis, repair method

D: Innovator XPD

macro complex data 

physical reuse- HBM net, auto-replacement, function: rotate, mirror,

original separately process, 500,000 pin can be processed in short time period

tuning in real time, 75% cycle time reduction