Proposal for physical failure analysis services

Hi Okutso San

I hope this message finds you well. I am collaegue of Kevin Wang and I am taking over this P0 PJ pFA case. Upon receiving this delicate samples which has smaller bump with finer pitch, there is a concern that they may deform too easily after removing substrate with an inherent risks that can lead to failure. We would recommend to outsource to 3rd party with experienced knowledge and advanced technology.

after removing the BU substrate.We would recommend to cold mounting resin to preserve its mircostructure. And then precisely grinding to the desired thickness.

Given their delicate nature, there is a concern that they may deform too easily after removing the build up substrate. We understand the importance of obtaining the accurate and reliable results, and this case, we would recommend to cold mounting of the samples before removing the build up substrates.

The FIB analysis on an hourly basis, and the charges are calculated accordingly.The complexity and duration of the cross sectional examination process can vary depending on several factors, including the desired depth of analysis, the nature of the samples.

We've committed to assisting  you in any way we can to achieve your research objectives, so please feel free to reach out to discuss potential solutions or further clarification on this matter.

Thank you for your understanding and cooperation.

Best regards.

Objective:

To identify the root cause of the failure, validating the process thermal compression bonding condition

Scope of work:

1. Sample preparation

• Cold mounting of the samples to preserve its mirostructure
• Precision grinding to achieve the desired thickness, ensuring minimal damage to the sample

2. Cross-sectional study

• Conducting a cross-sectional examination to analyze its internal structure
• Utilizing microscope technology SEM to observe any defects, or anomalies

3. Analysis and Reporting

• Interpreting the findings from the cross-sectional study
• Providing a detail report with comprehensive analysis

Timeline:

Provide an estimated timeline for completing each phase of the project, from samples preparation to final report delivery. Ensure that the timeline is realistic and accounts for potential challenges or delays.

Cost:

Present a break down of the costs associated with the physical analysis services, including labor, materials, and equipment usages. Be transparent about any additional fees or expenses that may arise during the project.

UMI P1 Flip Chip process flow

Milestone

Drawing已經確認完成並且在1/9進行pre-DR meeting, tooling kits基本上都已經到廠內了HBM cube的部分是在P8做,預計會在5月底前會使用ES3 recovery wafer到P11作flip chip封裝

UMI Overall Project Status(標準customer information)

P0從去年12月就有封一些樣品給客戶做測試, FT test pass.不過這只是HBM model
那真正量產的Device會是從P1開始, design 部分是在去年完成的
P2目前還在設計階段

Overall PKG information 的文件資料 其實跟先前是一樣的
P0是之前都是客戶的consign 材料 我們只做一些封裝
P1之後開始都是由P8開始做HBM cube 再送到P11作封裝
SOC部分是客戶提供一片 共用在P0/P1/P2 project上面

這是P0去年12月中做的封裝/樣品數量/封裝和測試的主要流程

收到來料Shinko含interposer的iTHOP SBT裡面的L/S 是2/2線路的 SOC 的bump pitch是45um & HBM2的Bump pitch是55um, 用TCB bonder COS方式bond 這三顆晶片 在用underfill在interposer上面做gap filling 在上stiffner ring在翻轉過來做電容SMT 然後在做ball mount P0 大致上就是這五大流程 主要是在P0的時候主要的關鍵站在HBM &SOC & interposer之間殘留錫部分有沒有joint 用SEM確認成形後bump gap確認是否有在我們的預測範圍內 die gap看起來差不多38um 都很接近設計值 有確認到TCB bump joint 用X-ray確認到chip to interposer bump to pad 的之間 確認是否有偏移的狀況 目前看起來都很正常 沒有問題 能力檢查部分都沒問題

P1 客戶提供兩種Wafer die   & die B 細部流程會在後面詳述
 Die B會在P8先做Backside grinding /wafer mount/ dicing 只做front side mirco bump
而Die A部分一樣在P8的back end 的CoW 當站用TCB mount die B 上去die A 然後在做wafer form molding 然後再進行mold grinding MDG有分Z1 (粗磨)& Z2+Z3(細磨) 由於P8就只有粗磨 所以Z2 & Z3會在P11B作業 做完mold grinding 之後又回到P8做最後一道copper pillar bump 然後在P8做wafer mount & dicing  然後再到P11解ＵＶ後做TCB　在做ＨＢＭ封裝

Die B主要是在front side長bump 然後wafer thinning & wafer dicing 以切完單 M-ring tape方式 一起進backend 的COW

Die A 的話在front side先做RDL 然後在coating PI 然後再長micro bump & copper post 主要是這四大流程  然後會以wafer form 方式shipping 

接下來講封裝部分 會以die A為基底  用TCB bond Die A 到Die B上面 做完chip on wafer 之後 molding 在做mold grinding  然後在做最後一道copper pillar bump 最後HBM cube dicing以tape & reel方式shipping 到P11B 大體上後面封裝跟P0是一樣的

Shinko會把organic interposer mount 在10L ABF SBT 上面 主要是以NCF方式bonding 
line/space:2/2 pad pitch :40um thickness:100um
Process flow 主要是以supporting carrier 去做rigid layer formation 主要是以壓合方式去做rigid layer做carrier 在做chemical /mechanical polishing  在做thin film的formation 在做4層的RDL  coat曝光顯影 4+1 去掉support carrier之後做solder printing 這是錫鉍SnBi 在貼NCF在dicing 當下面的10L ABF 做完  經過封裝流程 bond interposer 在10L ABF SBT 

POD& 卡通圖的對應 用1~6 的示意圖來表示

從P8哪裡得來料使用D185 已經切單好,只要解UV(大概200mJ)就可以在P11pick up die ,一開始先SBT prebake, SBT來料是以unit type 放在tray 盤上面, SBT prebake之後就要轉移到boat 盤進行TCB bond,從flux clean 到tray 之間的作業需要用到standard 的boat 來進行作業, 所以需要有這個流程, 轉換standard boat之後就可以做flux clean, 再prebake, 再上underfill前做plasma 清洗,點完膠之後再做curing 然後AOI,之後在上stiffiner再烤乾,就可以反面做電容SMT, 看完SMT AOI之後就可以做ball mount, 這時候就可以轉到tray盤, PD會提供tray 盤, 再做OS跟AOI

目前只有try to boat & boat to tray 的站點 沒有boat to standard boat的站點
SAP+ES+MES串好   797/798 tray to TCB boat & boat to standard boat 命名站別
需要拉開來 避免混淆 EE&ME確認是否可以新增設備名稱(公安需要審核) 再綁新的站別
5月中三合一的站別需要變更
斗哥&Derek串好 先暫用標準流程先跑 未來會變更

GX料號是客戶consign 料號, ring 先用客戶

電容5S & 5B都會用到
三家tray 都已經到PTI了 到時候會先看看作業性&外觀就會提供給相關人員

How to write meeting minutes

 1. Preparing

-->write the agenda

-->prepare the meeting minutes template

-->Date, notes, action items, decision, summary

2.Writing

-->Digitally is better analog, can save and store the notes, save the time

-->Facts or things happened write down and share them to participants

-->Write down and documented them and write them down with clear date

-->Capturing questions and notes as much as you need.

3. Re-writing

-->spelling errors, maybe  big differences , in order to let anybody understand them

-->make you fresh in your head

-->To skim through as fast as possible

-->easily searchable, in separate pages

5.

Concise sounds confident!

Concise sounds confident!

1. Avoid long, demanding sentences.

2. Practive speaking in bullet points

Example:

I have several steps to accomplish by the end of the day.

I have to outline the proposal

I'll run that by the copy editor

I'll then get the final version approved

I'll likely to add some images and illustrations to bring it to life

We want this to look profesional and polished instead of looking like a rough outline of ideas.

3. Use short talking turns in conversations.

Leader like ways expressions

Tips about speck like leaders

Definition: can make contributions to the people around us and have more impact

1st tip: Don't over opologize

-->apologizing is a way to avoid disagreements, or placed on keeping the peace rather than disagreements, and giving your honest opinion

-->People may often apologize even though you are not doing wrong

-->You may appear less confident 

-->You coworkers may doubt your ability to do your job

-->You may come across as insecure weak or indecisive

-->Save your apologies for when they're actually needed or actually did it something wrong

a. To express your thanks and appreciation instead of saying you're sorry

ex: Thanks for pointing that out, I'll address it

ex:I'll appreciate your feedback and I'll make those adjustments

ex: Thank you for hearing me out.

ex: Thank you for putting in the extra effort

ex. Do you have a minute to talk?

ex.I'll like to jump in here for a moment

2nd tip: Don't minimize(downplay) your accomplishments

-->People will not know how good you are when you are not comfortable talking about it

-->Humility at work will generally not benefit you

-->Assertiveness is good but arrogance is bad 

ex. Last year my team was able  to help 20 clients to exceed their revenue goals

ex.We were grateful to play a central role in helping the company grow to over 500 employees

ex. Our team managed to cut customer's complaints and refund for the company by 50%

3rd tip: Eliminate the uncertainty in speech

--> Leaders always strike difficult balance, they have to say open-minded about the opinions of other people, at the same time, they must be as clear as crystal when they appears their own point of you 

ex. I haven't come across that yet(I'm not sure)

ex. I predict/anticipate/envision(I think/ I feel)

ex. Based on the data, it appears that (I think/ I believe)

ex. From my analysis, it's clear that(I am not certain)

ex. I need to verify whether

ex. First let me confirm before I make a recommendation

ex. I don't have that information right now(I don't know)

ex. I'm not clear in a position to answer that 

ex. I'll make it happen/ I'll do my best to ensure it's completed

ex. We'll do everthing in our power to deliver it to client on time.

ex. Do you have any questions?

ex. What are your thoughts?

ex. Do you have any thoughts on that?

ex. Does that raise any questions for you?

Mail to WEC for underfill/MUF selected material

 Thanks for your time to discuss about the encapsulation method of FCCSP last meeting

Due to the constraint adhesive layer thickness, the 50um bump height with narrower gap has fewer products experience in PTI. It is probably would have non-joint and incomplete filling issue for FCB and MD. 

However, the solder volume could be enhanced at solder on pad. In addition to the narrow gap around 45um could be completely filled by 25um filler cut size MUF by adjusting by process parameters during the products setup.

We could try MUF at first and select CUF as backup solution if problem occured.

Please share your feedback if any concerns.

HBM learning

 1. SBT surface finish treatment

2. Adhesive bonding material properties

3.Bump density vs necessary dummy bump 

4.PI impact on thermal compression bump

Advantages of 3D test flow

1. Improving assembly yield by allowing stacking dies that are known to be defect-free

2. Enables die matching

3.Allows detection of defects that are inherent to the TSV

Defect mechanism

1. Voids in the metal fill(impedance faults leading to high speed data path failure)

2. Pinholes in TSV dielectric(Shorts btw TSV & SBT)

3.Thermo-mechanical stress(Cracks in TSV or microbumps)

4. Bond misalignment(Shorts or opens)

A letter to my sister

     Once you decided to buy a unit in Kuala Lumpur, I felt dissapointed that you and mother did not ask my opinion before buying a house. To make an informed decision, you suppossed to be requested to acess any risk may occur, and implement mitigation plans. The idea that I have heard only the greedy ideas that the housing prices will be increasing after LRT established. As we know, if government wants to build the infractructures, it should take at least 5~ 10 years and the traffic jam will never ending until the infrastructure has been finished. You were easily to be tricked when somebody told you that it must be increasing surprisingly.

    On the behalf of a older sister, you should be responsible to take care all of the financial status in family. Since you asked me and brother to come to Germany with you. You are destroying our lives, do you know? If you were not studying in Germany, you could save more and earn more money than now. You do not need to ask mother to pay a downpayment and lost her retirement money for the rest of her life. Our father also would not suffered depressed to live in a small room with mother for almost 3 years during the pandemic. 

in the past time

    從我們決定要買房子之後，我就去了銀行轉錢，我去玉山轉了一萬美金，台灣這裡抽取了８００元，馬來西亞也抽了１２００元左右．手續和轉帳費用就花了２０００多元的費用，讓我覺得大虧很多．後來我在ＦＢ尋找ＭＩＴ訊息，有人建議跟學生互換或使用虛擬幣（這兩種方式都不會抽取手續費）．在訊息裡面就有好幾個學生或來玩的學弟妹需要台幣的，我就進行了好幾次交易．一開始我會親自會面或交換證件證明本人做交易．後來就覺得馬來西亞人滿可以相信的，就沒有這麼做了

    那個學弟Ｇｏｈ　Ｐｅｉ　Ｊｉｅ是我目前最大戶，他會幫我去詢問其他馬來西亞朋友，也幫忙處理了好幾筆． 一開始我們只是單純互換匯率，我們只是純粹無聊的時候聊天，我們也從來沒有互相提供照片．後來我得知他要回馬，他就說可以幫忙帶一些名產給我．我就很不好意思，覺得要請他吃飯或送機回報一下心意．畢竟他幫了我很多．我那個貪小便宜個性, 就跟他要求買了一堆．的確，我想要送他回台北表達謝意，後來我到了機場，我擔心他不認得我（因為我沒有見過面），我就拍照給他，讓他了解下我的樣子．我的確是等一段時間，我就只有拿了名產就回家，他說他自己可以搭車回家．後來是我覺得自己賺了很多，因為他幫忙買了很多糖果，娘惹糕，名產，他的行李超重，也沒有跟我多收錢，他還額外請我吃咖啡糖果和香蘭蛋糕，我拿了這麼多，只收了我２５００元左右，我當然就很開心的回覆他我很喜歡．他在訊息也提到說有些學弟妹想要換學費，我當然也同意等他回覆．最近馬幣也跌很多，我就發訊息詢問進度，我也並沒有想要找他聊甚麼．當然我內心是寂寞的.希望有人可以聆聽我的心事.

      一直以來我很感謝你的無微不至的照顧，你是我心目中的男神，不能隨意使用語言侵犯．從小我的個性就是個大辣辣的傻大姊，很喜歡照顧朋友，同學，同事，我覺得照顧別人或者是跟別人亂聊天是我紓壓的方式．我會覺得這樣的我會很自在．自從認識你之後，我身邊已經沒有好朋友了，我內心是寂寞的，常常無法找人聊天紓壓．我都是靠著聽ｙｏｕｔｕｂｅ來麻醉自己．我只是很想找個不認識的人聊天，這樣我內心就不會像我杜絕那個汐止朋友那麼有點難過．我知道自己不能再有好朋友，可是我是多麼渴望找人亂聊心事，就像我以前傻大姊的那種感覺．我喜歡去跳舞也是因為我可以像瘋子那樣解放自我．現在的我，無聊的時候就只能睡覺，聽ｙｏｕｔｕｂｅ睡覺

    像是那天，我被老闆欺負，很想請假去唱歌，你那天說你媽媽要開刀心情不好，所以沒心情去，我也不知道找誰抒發情緒．跟你說的話，我認為你會覺得這種壓力跟你相比很小，所以後來我也沒有跟你說，我也不知道找誰說....

Sexual harrassment

     Recently, Taiwan is rocked by wave of sexual harassment allegations sparked by Netflix show. Over a week, more than hundred people spoke out the allegations against the people in power. There is a man I always concerned about. 

    In 2007, I worked illegally as an waitress in a private club because I was a foreign student. However,  I need a lot of money to have a  master degree tuition fees. He is the one of my customer in a private club. He always went to the private club with a lot of politician workers or partician leaders to have some fun, He was so generous to pay some extra tips to the waitress when he felt enjoyable to have special services, such as drinking a cup of wine with him. I was about the to be drunk after drinking some whisky or red wine with him. 

    After 3 months working in the club, I felt guilty to work illegally and I could not deal with getting drunk when I worked. I felt asleep, nausea or vomit after drinking a lot with my customer. Even though the pay is higher than other part time job, I still could felt my alcohol intolerance could be a life threatening reactions to my immune system.

    One day evening in the past, I just packed my backpack and ready to resign from my working place. When I was ready about to prepare my exam in library. I saw the politician in a car. His body guard just grabbed my hand and pushed me into his car. It was a daunting task to reject his invitation because the body guard was a a former police officer but I was an illegal waitress. When I entered his car, I felt very uncomfortable when he touched my thighs and concerned about my leaving from the club. I exclaimed and begged him to release me. Fortunately my ex-boyfriend was standing outside of the politician car. I was trying to forget about details on that day until the me2 activities sparked and he was about to be accused. A reporter 

Ashame of her

     What a shame to borrow money from your family but never told about her salary statements and debt that she need to cover