Hi Okutso San
I hope this message finds you well. I am collaegue of Kevin Wang and I am taking over this P0 PJ pFA case. Upon receiving this delicate samples which has smaller bump with finer pitch, there is a concern that they may deform too easily after removing substrate with an inherent risks that can lead to failure. We would recommend to outsource to 3rd party with experienced knowledge and advanced technology.
after removing the BU substrate.We would recommend to cold mounting resin to preserve its mircostructure. And then precisely grinding to the desired thickness.
Given their delicate nature, there is a concern that they may deform too easily after removing the build up substrate. We understand the importance of obtaining the accurate and reliable results, and this case, we would recommend to cold mounting of the samples before removing the build up substrates.
The FIB analysis on an hourly basis, and the charges are calculated accordingly.The complexity and duration of the cross sectional examination process can vary depending on several factors, including the desired depth of analysis, the nature of the samples.
We've committed to assisting you in any way we can to achieve your research objectives, so please feel free to reach out to discuss potential solutions or further clarification on this matter.
Thank you for your understanding and cooperation.
Best regards.
Objective:
To identify the root cause of the failure, validating the process thermal compression bonding condition
Scope of work:
1. Sample preparation
- Cold mounting of the samples to preserve its mirostructure
- Precision grinding to achieve the desired thickness, ensuring minimal damage to the sample
- Conducting a cross-sectional examination to analyze its internal structure
- Utilizing microscope technology SEM to observe any defects, or anomalies
- Interpreting the findings from the cross-sectional study
- Providing a detail report with comprehensive analysis
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