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チップや能動。受動部品を内蔵した

独自の半導体パックージグ技術を駆使し、優れ電気特性と高い

信頼性を備えた小型　低背パックージとして、小型

iTHOP preshrinkage issue

 The actual shrinkage rate of iTHOP is higher than anticipated, influenced by the smile warpage behavior. The inspection of iTHOP from mark to mark distance was validated that its value is smaller than actual design value. 

Based on our observation, the larger warpage , longer distance between mark to mark, which exhibits more expansion which was validated by the stage DOE experiment from Shinko & PTI. The inner flip chip pad showed that it has higher shrinkage rate, making alignment with the bumping from HBM side challenging.

The thinner organic interposer is more likely to be influenced by the properties of interposer material, it tend to be expand more freely even though vacuumed by the stage, but once bonded, it will be more easily pulled and conformed by ABF substrate.

-->Understanding the interactions can help in optimizing the design to achieve the desired alignment.

3D X ray imaging analysis request

 Since the expansion of substrate during heating with TCB bonding method, different temperature bonding have been studied to reduce the misalignment issue. The effect of temperature is limited, based on 2D X-ray imaging results showed that the farther away from the center, the misalignment value is worsen. We need further analysis with 3D X-ray to analysis if any voids, solder crack after TCB bonding

What is Q3D simulation

Ansys Q3D Extractor is a 3D quasi-static electromagnetic simulation software tool and lumped RLC parameter extractor.  It calculates fields, inductances, resistances, and capacitances. This tools that specializes in low-frequency power applications. It can quickly determine parasitic values of inductance, capacitance, resistance from 3D structures.Q3D can generate frequency dependent equivalent circuit netlists in many formats.

It provides automatic, accurate, and efficietn solution after refining the mesh throughout structure.