2022年5月9日 星期一

Basic delamination failure introduction

    Encapsulation electronic device has been developed for over 50 years. Interfacial delamination remained unsolved. Due to the inherent CTE and geometrical discontinuities, the bi-material interfacial become vulnerable that dominates failure mechanisms in thermal-mechanical reliability system. The matching of the mechanical and thermal characteristics of the bi-material is the decisive factor if they could bond closely without any unoccupied. How a romantic story. As an old saying, “Birds of a feather flock together”. We really could find that the attitude similarity and interest proximity determined the level of interpersonal attraction, no matter whether the gender is the same or not. 

    If a BGA is found to be badly connected, many methods have been investigated in preparing hydrophilicity surfaces, such as chemical etching, thermal treatment, plasma treatment, and the introduction of various functional groups on the surface of materials.

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Reflow soldering process

 Solder paste is used to temporary attach to the anywhere to all the contact pads, after which the assembly is subjected to the controlled h...