In order to examine the defect or structure, the cross-section destructive method is the vital means of inspecting the failure mode or initial point of the defects. The simple guideline is involved in cutting, mounting(potting), and grinding or polishing with abrasive materials.
Before performing the cross-section, the first step is to determine the interested area or determine the accurate position. Sometimes we would probably spend enormous time to get to the point that we want to.
but we would, of course, require an aggressive grinding medium which may annihilate the brittle silicon upon contact. In addition to destroying the materials we plan to analyze, we would probably spend an inordinate amount of time (not to mention expense) getting to this point. A better option is to cut the package near to the plane of interest, using a precision diamond saw, and then to encapsulate the specimen for subsequent preparation.
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