Meeting conversation in English

Project assistant manager
Hello, good morning, everyone. my name is Tomy. I’m responsible for managing intel for each A project from start to end. I am the chair of this meeting today. thank you all for coming at such notice. since everyone is here, let’s get started.

the purpose of today’s meeting is to discuss ways to improve customer service in A project.

R & D :

My name is christine. I am an engineer from research & design departure. my job is to design semiconductor package structures to the client’s specifications. I’m responsible for the whole design process, so I have to take the client’s ideas and turn them into a finished product. most of my time is spent experimenting with different designs and ideas and seeing what looks good because attention to detail is important in this kind of work. otherwise, I also can be an adviser to select the advanced material or process for dedicated innovative package design.

Marketing sales

my name is Fany. I’m the marketing manager here. my job is to analyze and interpret market and customer information for strategy development. my job is to generate a unique sales plan, develop pricing strategies, and to offer satisfying human resources. given the breadth of enhancements in A project, I am incorporating additional validation time prior to production release, which will streamline the deployment process for our customers and partners.

process integration engineering

my name is terry. I’m the process integration engineer, who is the coordinator that provides process integration engineering expertise to semiconductor manufacturing. I also need to consolidate customer requirements for specific customized applications and cooperates with process engineers internally to ensure and improve production yield.

Process engineering

My name is Craig. I’m the process engineer, who is responsible to minimize the process variations and excursions in the product manufacturing process so as to maximize the production yield. my major responsibility is composed of solve process issues, ramp up process technology transfer, develop tools to enhance yield or reduce production cost.

Chair(Tomy):

OK, we’re done with the introduction of everyone. Let’s look at the agenda. the first item of the agenda is the background and figure out why this s26a project isn’t performing as well as expected. Finally, we’ll clarify some questions and then make some decisions. Let’s move on and discuss.

Let me introduce the background.

Our customer has developed the new next-generation wafer A which is more advanced and looks more competitive than B. it has applied 3d packaging technologies and will offer approximately 10~15% improvements in performance per watt compared to the previous generation wafer. this production is set to be ready from the first quarter of 2022. First of all, I would like to thank you christine who has proposed several experiments, let her introduce these experiments to all of you

Christine(R&D)

In order to select the most optimized process method to confirm all the process characteristics and confirm all the process risks. I’d propose 3 types of methods of dicing method, the first one is dicing after grinding, the second one is dicing before grinding, the third one is stealth dicing before grinding, the last one is laser grooving before dicing. Here the results showed that the first one with a conventional blade saw method, the metal layer has peelings, cracks, chipping. The results with the 2nd & 3rd methods observed delimitation after the reliability test. The best solution is the last one with laser grooving before dicing. Experimental results have shown that dicing before applying laser grooving can significantly minimize the dicing defects. R&D strongly suggested adding the laser grooving process before dicing. however, there is a very limited laser grooving machine in our production line. Therefore I have requested the process engineer to confirm if any possibility to improve the process method.

Craig(Process Engineer)

Ok, let me present the test results by different process methods here, here you can see by slowing down dicing speed can significantly decrease the defect rate. The original cutting speed is 3000 rpm(rotation per minute), all of these results showed that at least need to increase to 10,000 rpm to reduce all the defect modes.

Tery(Process Integration Engineer)

I see your point, however, I don’t think the idea of evaluating this new test method is a not good idea or if it is beneficial to our company. If the new test method has been implemented, this will impact all our production volume capacity. You might want to consider that if the unit per hour has been lower at least triple times, it may impact other customer’s production lines and the lead time will be longer.

Fany(Sales)

To be honest, I’m not sure about this idea. Tomy, but could you elaborate on how this will fit with our existing marketing campaigns?

Chair(Tomy):

As I said before, this S26A process has more challenging than the previous generation wafer when its technology fast scaling down in node size where the low-k dielectric is used. If this project has been launched successfully, our company will have at least 60% cost benefit per unit. 

Fany(Sales)

I see your point, however, I don’t think the idea of implementing laser grooving resources has a benefit for both customers and our company. How about we ask our customer to purchase the dedicated laser grooving machine for this project, it might not bring any impact to another customer, I also try to negotiate with our customer to increase the unit price for the new process implementation requirements.

Chair(Tomy):

That sound good, any question?No, ok…

To wrap up, let’s remind you that this project matters to every departure. I am going to get a team together to make it happen, hope all of you have a nice day.