1. SBT surface finish treatment
2. Adhesive bonding material properties
3.Bump density vs necessary dummy bump
4.PI impact on thermal compression bump
Advantages of 3D test flow
1. Improving assembly yield by allowing stacking dies that are known to be defect-free
2. Enables die matching
3.Allows detection of defects that are inherent to the TSV
Defect mechanism
1. Voids in the metal fill(impedance faults leading to high speed data path failure)
2. Pinholes in TSV dielectric(Shorts btw TSV & SBT)
3.Thermo-mechanical stress(Cracks in TSV or microbumps)
4. Bond misalignment(Shorts or opens)
