Beginner of semiconductor

    To make some room for some exciting electric conductivity tranmitting from somewhere to everywhere and transferring heat from processor to outward of  packaging, my company would like to simplify the process flow to enhance the production effeciency and reduce the products cost. Changes to explaining the features in process, throughout the next few months, I will translate the simplified professional words and integrated into a journal to give me more flexibilit in how I share and confirm that I understood what it means. I could allow myself to comment on blogs by acting myself as a beginner.

Fan out Technology

    The functionality integrated in the 2.5D or 3D multi chip packaging has become increasingly diverse and crucial for specific applications. Current research and design efforts will continue to extend the breadth of the system in package composition, the next new technology could likely be the most important things to connect between dies in the package.

    In 2016, TSMC introduced the Integrated FanOut Technology(InFO), was used for Apple A10 application processor for Iphone 7. It was the first commercial InFO product in the market. InFO package is located at the bottom and memory package is stacked on top, so it makes package on package. In InFO package, die is surrounded by molding compound. Typically Fan Out uses liquid mold compound instead of solid pellet shape. At the bottom of InFO, there is redistribution layer(RDL) instead of package substrate. Therefore, there is no package substrate because it is Fan Out. When it uses through InFO via to connect bottom for application processor and top package for memory. There are some technological innovations in TSMC InFO in 2016 for Applie iphone. It was the first wafer level fan out package by foundry and applied to high volume manufacturing. Usually packaging is provided by OSAT, outsourcing assembly and test providers. But TSMC is foundry which makes chips based on customer design. Its package size is larger than 10x10mm with 8x8mm die size, and it is for high I/O device, application in smart phone

The loss of my father

    Since I was a kid, I supposed my father was authoritarian, emotionally reserved, and effectively distant. He was as stern as a teacher when he found that my school scores were not good enough or I had not finished the meal prepared by my mother. He used to hit me with clothes hangers, or his muscular hands. The bruise would remain for at least one or two days. However, my mother told me that they will become more depressed when they beat harder.

    I lived in a low-income family, but my siblings and I had graduated from the best Chinese Independent high school in Kuala Lumpur. My father would try everything to pay our school expenses and living expenses. In my memory, my father's dilapidated green pocket just reserved a few coins at the end of every month. He never buys any luxury goods or consumes any expensive things in his life. He was the kindest person who wanted to save more money for his family. Even though our family become wealthier, my father was still very careful about his spending.

    He dedicated his whole life to raising us up from elementary school, and high school to university in order to give us a better future. He had low vision sight since he was born, and even though he had high intense pain in his eyes, he would not let us know, until he lost his eyesight, and we found that he got glaucoma. He was reluctant to quit his job after putting a lot of effort to persuade him several times. However, he lost his smile and was generally low-spirited as he worried about spending money on buying medicine or treatments. 

    At the end of 2019, I vividly remembered that I and my sister brought along my father to extend his passport, but he was furious about the extension money for waste. He would not live longer and threw his passport on the floor. Some people around us were frightened about his attitude and come to comfort his emotions. Fortunately, I had an opportunity to celebrate this 69-year-old birthday before I traveled back to Taiwan. He did not like to eat cake in his life but he had finished it on that day. Before I and my sister departed from Malaysia to Taiwan and Singapore, I strongly felt that he has unwilling to let us go apart from him.

    For the sake of the COVID-19 pandemic, I could not travel back to Malaysia, and I just could online talk with him, but until the March of 2022, he cannot hear anything as aged-related. We halted talking anymore until he was sent to the hospital in Jun, he was diagnosed with delirium and needed special medical treatment. He never feels curious about the updated news and was reluctant to eat or drink after taking the medicine, always sleeping for a whole day. He chose to adopt the kindest method to leave us, no more burden for us, he was our angel in our family.