How to work with your client to complete a project

Hi Adam,

    As we discussed previously, our end customer would like to kick off a new product that can meet the more stringent requirements on thermal cycling management. Please come out with some ideas to improve the preliminary design which has higher possible trace cracking.

    There are a few possible improvement ideas that need further discussion by next week:

1. The preliminary substrate design has some narrower traces width, resulting in a low resistance to trace cracking. We suggest increasing those traces' width with a special process from our vendor site.

2. The resistance depends not only on the defects on the substrate site. PCB thicker is easier to have higher stress for trace crack as well. We highly recommend reducing the total PCB thickness, please ask the end customer to deal with this solution

3. For most package designs, the thinner die thickness has lower stress for the package. However, it may suffer a warpage issue, therefore we would like to evaluate new encapsulation material with matches the thinner die thickness.

    I am writing a new proposal and then reviewing it with our process team members. You will receive the proposed ideas and contents brief by next Monday.

    We can begin work as soon as I receive your approval with my proposals. Thanks for your time.

Best,

Daisy