Describe about my company

   

    My company offered a full system solution for the preparation of semiconductor wafers to high specification surface finishes, prepare with precise geometric accuracy. From measuring initial wafer thickness, wafer separation by different dicing method, safely bonding fragile wafers to substrate for processing, capable for wire bonding over 1000 counts, encapsulated by water resistant epoxy molding compound, to manufacture the desired package units for different customers' requirement.

    My company products have been utilized in a broad application. Most of them are for portable, smart phone, tablet, SSD and so on. Above products are comparable very mature and have been mass production for over 15 years old. The major benefits come from the final test of packaging instead of the longer lead time from wafer preparation to unit isolations.

    The most challenging and rewarding projects are bumping, wafer level packaging, system in package, panel level fan out and so on. Even though these advanced technology have been published over the board meeting, but there are still have many hurdles need to be cope with. There is still has a room for improvement and need many experts to corporate together to solve the technical and machine capability problems.