Thanks for your time to discuss about the encapsulation method of FCCSP last meeting
Due to the constraint adhesive layer thickness, the 50um bump height with narrower gap has fewer products experience in PTI. It is probably would have non-joint and incomplete filling issue for FCB and MD.
However, the solder volume could be enhanced at solder on pad. In addition to the narrow gap around 45um could be completely filled by 25um filler cut size MUF by adjusting by process parameters during the products setup.
We could try MUF at first and select CUF as backup solution if problem occured.
Please share your feedback if any concerns.
